Hybrid header, 770669-1, AMP
Hybrid header: no, Connector system: wire-to-board, wire-to-device, Sealable: yes, Connector & contact terminates to: printed circuit board, Number of signal positions: 23, Number of positions: 23, PCB mount orientation: horizontal, Number of rows: 3, Nominal voltage architecture: 12 V, 24 V, 42 V, 48 V, 240 V, Primary product color: black, Mating tab width: 1.3 mm, Mating tab thickness: 1.3 mm, Mating pin diameter: 1.3 mm, Contact mating area plating material: tin (Sn), Termination method to printed circuit board: through hole-solder, PCB mount retention type: boardlock, Centerline (pitch): 4 mm, PCB thickness (recommended): 1.57 mm, Operating temperature (max): 100 °C, 105 °C, 65 °C, 70 °C, 75 °C, 80 °C, 85 °C, 90 °C, Operating temperature range: -40-105 °C, Circuit application: power & signal, Degree of protection: IP6K9K, Packaging quantity: 1
