280702-1 | AMP
Receptacle, 0.3-0.9 mm², AWG 22-18, crimp connection, tin-plated, 280702-1
Unit Price (€ / pc.)
0.1023 € *
Available: 320 pcs.
Available in 5 Days: 385,000 pcs.
Leadtime: 29 Weeks **
Total Price:
5.12 € *
Price list
Quantity
Price per unit*
50 pcs.
0.1023 €
100 pcs.
0.0928 €
500 pcs.
0.0797 €
1000 pcs.
0.0655 €
*incl. VAT plus shipping costs
**Subject to prior sale
Board-to-board connector contact, 280702-1, AMP
Applied Pressure: High, Connector System: Board-to-Board, Connector & Contact Terminates To: Wire & Cable, Contact Base Material: Phosphor Bronze, Contact Type: Socket, Contact Mating Area Plating Material: Tin, Contact Orientation: Straight, Contact Current Rating (Max): 5 A, PCB Mount Retention: Without, Connector Mounting Type: Board Mount, Centerline (Pitch): 3.81 mm, Accepts Wire Insulation Diameter Range: 1.8 - 2.3 mm, Wire Size: 22 - 18 AWG, Wire Size: 0.3 - 0.9 mm², Operating Temperature Range: -40 - 105 °C.
Technical specifications
| Ausführung | Buchsenkontakt | |
| Leiterquerschnitt | 0,3-0,9 mm² | |
| AWG-Leiterquerschnitt | AWG 22-18 | |
| Kontaktanschluss | Crimpanschluss | |
| Kontaktmaterial | Phosphorbronze | |
| Kontaktoberfläche Steckbereich | verzinnt | |
| Kontaktoberfläche | verzinnt | |
| Kontaktoberfläche Anschlussbereich | verzinnt | |
| Isolationsdurchmesser | 1,8-2,3 mm |
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Logistics
| Ursprungsland | DE |
| Zolltarifnummer | 85366990 |
Compliance
| RoHS konform | Yes |
| Stand der RoHS-Richtlinie | 3/31/15 |
| SVHC frei | Yes |