Soft solder rods with Germanium, lead-free, type Felder-ISO-Tin.
For bright solder joints (appearance as leaded solder joints), the Ni inhibiting layer prevents the development of whiskers, increased endurance of the solder joint by reducing growth of the IM phase, avoids negative influences on the alloy structure of crucibles and nozzle components of older soldering units with VA crucibles and on soldering iron tips, reduction of Cu leaching, homogeneous metal structure of the solder joint which allows for optimal hardening characteristics without microscopic cracks, reduction of the development of slag by approx. 50 to 70 % compared to Sn99.3Cu0.7Ni, improved tensile strength of the solder joints by approx. 10 %, reduces copper sputtering and simplifies refreshing of the solder filling.
Soft solder for bright solder joints, lead-free, type Felder-ISO-Tin Sn100Ni+.
