Adhesive, STRUCTALIT 8838 30 G, PANACOL
The STRUCTALIT 8838 30 G is a black, single-component, epoxy-based adhesive developed primarily for encapsulating electronic components on a printed circuit board. It is characterized by a low glass transition temperature, good flexibility and a fast thermal curing. Due to its structural viscosity, it enables improved flow control and targeted metering to individual components. Its particularly low halogen content prevents corrosion on electronic components. It is well compatible with fluxes and can thus ensure good and complete curing on electronic components. In the cured state, it is characterized by flexible encapsulation of electronic components. Temperature and humidity tests have proven that the adhesive does not affect the electronic properties of individual components.
