RE100-LF | Roth Elektronik
Breadboard, 100 x 160 mm, pitch 2.5 mm, single sided, FR4 epoxy, Cu 35 µm, RE100-LF
Prototyping board, RE100-LF, Roth Elektronik
With single-sided plating, 2.5 x 2.5 mm perforation matrix. With solder lands, no standardized connector receptacle.
Dimensions: 100 x 160 mm.
Hole diameter: 1.0 mm.
Substrate: epoxy resin FR 4, hot-tinned (HAL lead-free).
Copper plating: 35 µm.
Board thickness: 1.5 mm.
Perforation matrix: 37 x 62 solder lands.
Diameter of solder lands: 2.2 mm.
Version | breadboard | |
Width | 160 mm | |
Throughplated | No | |
One / two-sided | single sided | |
Height | 1.5 mm | |
copper strength | 35 m | |
Length | 100 mm | |
Hole diameter | 1 mm | |
Material | FR4 epoxy | |
Surface type | hot air leveling (HAL) | |
Grid | 2.5 mm |
Country of origin | BG |
Customs tariff number | 85340019 |
RoHS conform | Yes |
Date of RoHS guidelines | 3/31/15 |
SVHC free | Yes |