RE200-LF | Roth Elektronik
Lab board, 100 x 160 mm, pitch 2.54 mm, single sided, FR4 epoxy, Cu 35 µm, RE200-LF
This item is no longer available.
As an alternative, we recommend the following item:
Circuit board, 100 x 160 mm, pitch 2.54 mm, single sided, FR4 epoxy, Cu 35 µm, BYB-3-11H6038
Order No.: 11H6038
Manufacturer: by.B
per pc. 7.7350 € *
Prototyping board, RE200-LF, Roth Elektronik
Single-sided plating, 2.54 x 2.54 mm perforation matrix. With solder lands, no standardized connector receptacle.
Format: 100 x 160 mm.
Hole diameter: 1.0 mm.
Substrate: Epoxy resin FR 4, hot-tinned (HAL lead-free).
Copper plating: 35 µm.
Board thickness: 1.5 mm.
Perforation matrix: 38 x 61 solder lands.
Diameter of solder lands: 2.2 mm.
Technical specifications
| Version | Laborkarte | |
| One / two-sided | einseitig | |
| Material | FR4 Epoxid | |
| Throughplated | No | |
| Grid | 2.54 mm | |
| Length | 100 mm | |
| Width | 160 mm | |
| Height | 1.5 mm | |
| Hole diameter | 1 mm | |
| copper strength | 35 m | |
| Surface type | Heißluft-Verzinnung (HAL) |
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Logistics
| Country of origin | BG |
| Customs tariff number | 85340019 |
Compliance
| RoHS conform | Yes |
| Date of RoHS guidelines | 3/31/15 |
| SVHC free | Yes |
