RE200-LF | Roth Elektronik
Lab board, 100 x 160 mm, pitch 2.54 mm, single sided, FR4 epoxy, Cu 35 µm, RE200-LF
Prototyping board, RE200-LF, Roth Elektronik
Single-sided plating, 2.54 x 2.54 mm perforation matrix. With solder lands, no standardized connector receptacle.
Format: 100 x 160 mm.
Hole diameter: 1.0 mm.
Substrate: Epoxy resin FR 4, hot-tinned (HAL lead-free).
Copper plating: 35 µm.
Board thickness: 1.5 mm.
Perforation matrix: 38 x 61 solder lands.
Diameter of solder lands: 2.2 mm.
Technical specifications
| Ausführung | Laborkarte | |
| Breite | 160 mm | |
| Durchkontaktiert | No | |
| Ein-/Zweiseitig | einseitig | |
| Höhe | 1.5 mm | |
| Kupferstärke | 35 m | |
| Länge | 100 mm | |
| Lochdurchmesser | 1 mm | |
| Material | FR4 Epoxid | |
| Oberflächenart | Heißluft-Verzinnung (HAL) | |
| Rastermaß | 2.54 mm |
Download
Logistics
| Ursprungsland | BG |
| Zolltarifnummer | 85340019 |
Compliance
| RoHS konform | Yes |
| Stand der RoHS-Richtlinie | 3/31/15 |
| SVHC frei | Yes |
