Prototyping board, RE201-LF-DS, Roth Elektronik
Double-sided with 35 µm copper plating. The component side is entirely coated, with holes etched free to prevent short-circuits on components. Users can connect this plating to ground potential to achieve maximum shielding of the electrical components against those on wiring side for a high degree of functional reliability of RF, digital and analog circuits; Format: 100 x 160 mm. Substrate: epoxy resin FR 4, hot-tinned (HAL lead-free). Grid: 2.54 x 2.54 mm. Hole matrix: 34 x 54 solder lands with diameter of 2.0 mm. Option for installing connectors to DIN 41612 design C, 32-, 64- and 96-pole. Hole diameter: 1.0 mm. Board thickness: 1.5 mm.
Type: RE201-LFDS, 100 x 160 mm, epoxy resin.