RE210-S1 | Roth Elektronik
Breadboard, 100 x 160 mm, pitch 2.54 mm, single sided, CEM3 laminate, Cu 35 µm, RE210-S1
Prototyping board, RE210-S1, Roth Elektronik
Without standardized connector receptacle; Hole diameter: 1.0 mm, single-sided 35 µm copper plating. Substrate: CEM 3, 1.5 mm, HAL lead-free. Grid: 2.54 x 2.54 mm.
With array of 38 x 61 solder lands, 2.2 mm², type RE210-S1.
Technical attributes (type, Format): RE210-S1, 100 x 160 mm.
Version | breadboard | |
Width | 160 mm | |
Throughplated | No | |
One / two-sided | single sided | |
Height | 1.5 mm | |
copper strength | 35 m | |
Length | 100 mm | |
Hole diameter | 1 mm | |
Material | CEM3 laminate | |
Surface type | hot air leveling (HAL) | |
Grid | 2.54 mm |
Country of origin | BG |
Customs tariff number | 85340019 |
RoHS conform | Yes |
Date of RoHS guidelines | 3/31/15 |
SVHC free | Yes |