RE220-LF | Roth Elektronik
Lab board, 100 x 160 mm, pitch 2.54 mm, single sided, FR4 epoxy, Cu 35 µm, RE220-LF
Discontinued
Prototyping board, RE220-LF, Roth Elektronik
Single-or double-sided, 35 µm copper plating. With option for installing connectors to DIN 41617 (31-pole); Hole matrix: grid 2.5 x 2.5 or 2.54 x 2.54 mm, 37 x 58 solder lands. Diameter of solder lands: 2.2 mm. Hole diameter: 1.0 mm. Substrate: phenolic resin laminated paper FR 2, organic surface protection (OSP) or epoxy resin FR 4, hot-tinned (HAL lead-free). Board thickness: 1.5 mm.
Single-sided plating, 2.54 x 2.54 mm grid, type RE220-.
Technical attributes (type, Format, substrate): RE220-LF, 100 x 160 mm, epoxy resin.
Version | lab board | |
Width | 160 mm | |
Throughplated | No | |
One / two-sided | single sided | |
Height | 1.5 mm | |
copper strength | 35 m | |
Length | 100 mm | |
Hole diameter | 1 mm | |
Material | FR4 epoxy | |
Surface type | hot air leveling (HAL) | |
Grid | 2.54 mm |
Country of origin | BG |
Customs tariff number | 85340019 |
RoHS conform | Yes |
Date of RoHS guidelines | 3/31/15 |
SVHC free | Yes |