RE220-LF | Roth Elektronik
Lab board, 100 x 160 mm, pitch 2.54 mm, single sided, FR4 epoxy, Cu 35 µm, RE220-LF
Abgekündigt
Prototyping board, RE220-LF, Roth Elektronik
Single-or double-sided, 35 µm copper plating. With option for installing connectors to DIN 41617 (31-pole); Hole matrix: grid 2.5 x 2.5 or 2.54 x 2.54 mm, 37 x 58 solder lands. Diameter of solder lands: 2.2 mm. Hole diameter: 1.0 mm. Substrate: phenolic resin laminated paper FR 2, organic surface protection (OSP) or epoxy resin FR 4, hot-tinned (HAL lead-free). Board thickness: 1.5 mm.
Single-sided plating, 2.54 x 2.54 mm grid, type RE220-.
Technical attributes (type, Format, substrate): RE220-LF, 100 x 160 mm, epoxy resin.
Ausführung | Laborkarte | |
Breite | 160 mm | |
Durchkontaktiert | No | |
Ein-/Zweiseitig | einseitig | |
Höhe | 1.5 mm | |
Kupferstärke | 35 m | |
Länge | 100 mm | |
Lochdurchmesser | 1 mm | |
Material | FR4 Epoxid | |
Oberflächenart | Heißluft-Verzinnung (HAL) | |
Rastermaß | 2.54 mm |
Ursprungsland | BG |
Zolltarifnummer | 85340019 |
RoHS konform | Yes |
Stand der RoHS-Richtlinie | 3/31/15 |
SVHC frei | Yes |