RE225-LF | Roth Elektronik
Lab board, 100 x 160 mm, pitch 2.54 mm, single sided, FR4 epoxy, Cu 35 µm, RE225-LF
Prototyping board, RE225-LF, Roth Elektronik
Single-sided with 35 µm copper plating; Substrate: laminated paper FR 2, organic surface protection (OSP) or epoxy resin FR 4, hot-tinned (HAL lead-free). Board thickness: 1.5 mm. Format: 100 x 160 mm. Version: with sub-D socket to DIN 41652 2 x 25-pole, 35 x 42 solder lands with diameter of 2.1 mm, hole grid: 2.54 x 2.54 mm, hole diameter: 1.0 mm, 2 potential traces.
Type: RE225-LF, 100 x 160 mm, epoxy resin.
Version | lab board | |
Width | 160 mm | |
Throughplated | No | |
One / two-sided | single sided | |
Height | 1.5 mm | |
copper strength | 35 m | |
Length | 100 mm | |
Hole diameter | 1 mm | |
Material | FR4 epoxy | |
Surface type | hot air leveling (HAL) | |
Grid | 2.54 mm |
Country of origin | BG |
Customs tariff number | 85340019 |
RoHS conform | Yes |
Date of RoHS guidelines | 3/31/15 |
SVHC free | Yes |