Prototyping board, RE317-LF, Roth Elektronik
Single-sided with 35 µm copper plating. With option for installing connectors to DIN 41612 design C (32-pole; grid: 5.08 mm). Format: 100 x 160 mm. Substrate: phenolic resin laminated paper FR 2, organic surface protection (OSP) or epoxy resin FR 4, hot-tinned (HAL lead-free). Grid: 2.54 x 2.54 mm. Hole matrix: 37 x 55 solder lands, 2.0 mm². Hole diameter: 1.0 mm. Board thickness: 1.5 mm.
Technical attributes (type, Format, substrate): RE317-LF, 100 x 160 mm, epoxy resin.