Prototyping board, RE334-LF, Roth Elektronik
Double-sided, 35 µm copper plating (through-plated); Format: 100 x 160 mm. Substrate: epoxy resin FR 4, hot-tinned (HAL lead-free). Grid: 2.54 x 2.54 mm. Hole matrix: 32 x 53 solder lands with diameter of 2.0 mm², option for installing connectors to DIN 41612 design C (32-, 64- and 96-pole). Hole diameter: 1.0 mm. Board thickness: 1.5 mm, component an solder side with solder resist coating and position labeling, component side with full copper plating.
Type: RE334-LF, 100 x 160 mm, epoxy resin.