QSFP/QSFP+/zQSFP+, 1761987-9, TE Connectivity
Form Factor: QSFP+, Pluggable I/O Product Type: Connector, Connector System: Board-to-Board, Sealable: No, Connector & Contact Terminates To: Printed Circuit Board, Number of Positions: 38, Data Rate (Max): 14 Gb/s, PCB Contact Termination Area Plating Material: Tin, Contact Current Rating (Max): .5 A, Termination Method to Printed Circuit Board: Surface Mount, Connector Mounting Type: Board Mount, Centerline (Pitch): .8 mm, PCB Thickness (Recommended): 1.45 mm, Operating Temperature Range: -55 – 105 °C, For Use With Pluggable I/O Products: QSFP+ Cage, Circuit Application: Signal, UL Flammability Rating: UL 94V-0, Packaging Method: Reel,Tape